US 12,108,532 B2
Printed circuit board with embedded bridge
Moon Seok Heo, Suwon-si (KR); and Hyung Ki Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Feb. 1, 2023, as Appl. No. 18/104,523.
Application 18/104,523 is a continuation of application No. 17/168,071, filed on Feb. 4, 2021, granted, now 11,602,051.
Claims priority of application No. 10-2020-0148660 (KR), filed on Nov. 9, 2020.
Prior Publication US 2023/0180388 A1, Jun. 8, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/142 (2013.01) [H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/11 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A printed circuit board with an embedded bridge, comprising:
a first insulating film, the embedded bridge being disposed on the first insulating film;
a second insulating film disposed on the first insulating film in a stacking direction; and
a first wiring layer disposed in the first insulating film,
wherein the second insulating film covers at least a portion of an upper surface of the embedded bridge,
wherein the first insulating film and the second insulating film cover a portion of a side surface of the embedded bridge,
wherein at least a portion of each of the first and the second insulating films is in direct contact with the side surface of the embedded bridge, and
wherein respective portions of the first and second insulating films, arranged outwardly of the first wiring layer in a direction perpendicular to the stacking direction, directly contact each other.