US 12,108,526 B2
Module and manufacturing method of the same
Junya Sato, Tokyo (JP); Atsushi Tanaka, Tokyo (JP); Ryosuke Mitsui, Tokyo (JP); and Yoshiaki Yamabayashi, Tokyo (JP)
Assigned to Japan Aviation Electronics Industry, Limited, Tokyo (JP)
Filed by Japan Aviation Electronics Industry, Limited, Tokyo (JP)
Filed on Jan. 21, 2022, as Appl. No. 17/581,280.
Claims priority of application No. 2021-022417 (JP), filed on Feb. 16, 2021.
Prior Publication US 2022/0264742 A1, Aug. 18, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 1/181 (2013.01); H05K 3/305 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A module comprising a structural object and a connection member, wherein:
the structural object comprises an electronic device and a resin portion;
the electronic device has an electrode;
the electronic device is embedded in the resin portion;
the electrode is exposed from the resin portion;
the connection member comprises a film-like base member, an adhesive layer, which is formed on the film-like base member and includes a pressure-sensitive adhesive, and a wiring, which is formed on the adhesive layer at least in part;
the connection member is stuck to the structural object;
the resin portion of the structural object directly adheres to the adhesive layer of the connection member at least in part; and
the wiring is pressed on the electrode of the electronic device;
wherein when the module is viewed in a plan, the adhesive layer adheres to the resin portion to surround the electronic device except for an area where the wiring is located.