US 12,108,524 B2
Bent laminated printed circuit board
Toshikazu Harada, Kariya (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed on Nov. 22, 2021, as Appl. No. 17/532,105.
Application 17/532,105 is a continuation of application No. 15/758,781, granted, now 11,212,913, previously published as PCT/JP2016/074415, filed on Aug. 22, 2016.
Claims priority of application No. 2015-178512 (JP), filed on Sep. 10, 2015.
Prior Publication US 2022/0087011 A1, Mar. 17, 2022
Int. Cl. H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/028 (2013.01) [H05K 1/024 (2013.01); H05K 1/0271 (2013.01); H05K 1/0278 (2013.01); H05K 3/0044 (2013.01); H05K 3/4617 (2013.01); H05K 3/4652 (2013.01); H05K 3/4691 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0191 (2013.01); H05K 2203/068 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A printed board comprising:
a laminate in which a plurality of insulating base members are laminated, the plurality of insulating base members being formed of the same material; and
one or more conductor patterns provided on the laminate, wherein:
the laminate includes a first substrate portion, a second substrate portion, and a bent part, the bent part being thinner than the first substrate portion and the second substrate portion;
the laminate includes a first main surface located on an inner peripheral side of the laminate and a second main surface located on an outer peripheral side of the laminate;
the first and second substrate portions each include an outermost insulating base member on the outer peripheral side of the laminate that is connected to an outermost insulating base member of the bent portion on the outer peripheral side of the laminate;
the one or more conductor patterns include a first conductor pattern located inside the laminate at the bent part;
in the bent part, a first distance from a surface located at an innermost circumference in the one or more conductor patterns to the first main surface is greater than a second distance from a surface located at a most outer circumference in the one or more conductor patterns to the second main surface;
no interlayer connection conductors are located in the bent part;
the first substrate portion includes a first innermost insulating base member on the inner peripheral side of the laminate;
the second substrate portion includes a second innermost insulating base member on the inner peripheral side of the laminate;
the bent part that the first conductor pattern is located on includes a third innermost insulating base member on the inner peripheral side of the laminate;
the third innermost insulating base member in the bent part that the first conductor pattern is located on is not directly connected to the first innermost insulating base member and the second innermost insulating base member;
the bent part bends to the inner peripheral side; and
a material of the plurality of insulating base members is a material that shrinks when cooled after heating.