US 12,108,521 B2
Circuit board and electronic device
Zhi Su, Guangdong (CN)
Assigned to GUANGZHOU FANGBANG ELECTRONICS CO., LTD, Guangdong (CN)
Appl. No. 17/642,024
Filed by GUANGZHOU FANGBANG ELECTRONICS CO., LTD, Guangdong (CN)
PCT Filed Dec. 17, 2019, PCT No. PCT/CN2019/125927
§ 371(c)(1), (2) Date Mar. 10, 2022,
PCT Pub. No. WO2021/047093, PCT Pub. Date Mar. 18, 2021.
Claims priority of application No. 201910867306.X (CN), filed on Sep. 12, 2019.
Prior Publication US 2024/0049381 A1, Feb. 8, 2024
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0218 (2013.01) [H05K 1/024 (2013.01); H05K 2201/0154 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A circuit board, comprising a circuit board body and a shielding film layer, and further comprising a dielectric layer, wherein the dielectric layer is arranged between the circuit board body and the shielding film layer,
wherein the circuit board body comprises a substrate layer, a wiring layer arranged on at least one side of the substrate layer and a covering film layer arranged on a side, away from the substrate layer, of the wiring layer,
wherein the covering film layer comprises a covering layer and a first adhesive film layer, wherein the covering layer is attached to a surface of a side, away from the substrate layer, of the wiring layer by the first adhesive film layer, the dielectric layer is arranged between the covering layer and the shielding film layer, and
the covering layer and the dielectric layer are of an integrated structure.