US 12,108,520 B2
Circuit board and circuit module
Kazuhiro Yoshida, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Jul. 12, 2022, as Appl. No. 17/811,947.
Claims priority of application No. 2021-123546 (JP), filed on Jul. 28, 2021.
Prior Publication US 2023/0031168 A1, Feb. 2, 2023
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0216 (2013.01) [H05K 1/181 (2013.01); H05K 1/184 (2013.01); H05K 1/189 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a magnetic shielding member having a first principal surface, and a second principal surface on an opposite side from the first principal surface; and
a flexible wiring board having a first surface, and a second surface on an opposite side from the first surface, wherein
the second surface of the flexible wiring board is fixed to the first principal surface and the second principal surface of the magnetic shielding member,
the first surface of the flexible wiring board includes a circuit area mounted with an electronic component, and one or more terminal areas where connection terminals are disposed,
the circuit area is disposed above the first principal surface of the magnetic shielding member, and
the flexible wiring board has a bent shape bent along the magnetic shielding member, so that the one or more terminal areas are disposed below the second principal surface of the magnetic shielding member.