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1. An optical transceiver, comprising: a housing, comprising a first housing and a second housing that are stacked on each other and together form an accommodation space; a circuit board, disposed in the accommodation space, wherein the circuit board has a first surface and a second surface, the first surface and the second surface face away from each other, the first surface faces the first housing, and the second surface faces the second housing; a first heat source, disposed on the second surface of the circuit board and electrically connected to the circuit board; and a heat conductive component, disposed on the first surface of the circuit board and thermally coupled to the first housing; wherein, a first area of a projection of the heat conductive component onto the second surface of the circuit board is larger than a second area of a projection of the first heat source onto the second surface of the circuit board; and the circuit board further has a recess, the recess is recessed from the first surface, and the heat conductive component is located in the recess; and the circuit board has at least one through hole penetrating through the first surface and the second surface, the heat conductive component comprises a main body, a first protrusion and at least one second protrusion, the main body is in thermal contact with the first housing, the first protrusion and the second protrusion protrude from a side of the main body and are spaced apart from each other, the first protrusion is located in the recess, and the second protrusion is located in the at least one through hole and thermally coupled to the second housing.
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