CPC H04N 23/52 (2023.01) [B61K 9/08 (2013.01); B61L 23/042 (2013.01); G02B 7/008 (2013.01); H04N 23/54 (2023.01)] | 23 Claims |
1. An imaging apparatus comprising:
a sensor unit including a sensor substrate on which an image sensor is mounted;
a main unit including a main substrate on which an electronic component configured to process an output signal from the sensor substrate is mounted;
a pair of arm portions configured to connect the sensor unit and the main unit to each other; and
a plurality of heat dissipation fins configured to dissipate heat generated in the sensor unit,
wherein the heat dissipation fins are provided between the pair of arm portions and in a direction perpendicular to a direction along which the pair of arm portions face each other, and
wherein a connection wire for electrically connecting the sensor unit and the main unit to each other passes through inside the arm portion.
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