US 12,107,569 B2
Semiconductor device
Naoki Shimizu, Matsumoto (JP)
Assigned to FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed by FUJI ELECTRIC CO., LTD., Kawasaki (JP)
Filed on Mar. 28, 2023, as Appl. No. 18/191,196.
Claims priority of application No. 2022-072581 (JP), filed on Apr. 26, 2022.
Prior Publication US 2023/0344423 A1, Oct. 26, 2023
Int. Cl. H03K 17/0812 (2006.01); H03K 17/08 (2006.01)
CPC H03K 17/08122 (2013.01) [H03K 17/08128 (2013.01); H03K 2017/0806 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A semiconductor device for operating a load, comprising:
an output element connected to the load and configured to perform switching to operate the load;
a drive circuit configured to output a drive signal to the output element, to thereby cause the output element to perform the switching;
an external terminal configured to be connected to a constant current source that is external to the semiconductor device, and to receive a constant current output from the constant current source;
a temperature sensor connected to the external terminal and configured to
operate with the constant current,
detect a temperature of the output element, and
output a temperature detection value;
a temperature state detection circuit configured to output a temperature state of the output element, based on a result of comparing the temperature detection value with a reference threshold; and
an abnormal level notification circuit configured to send out a notification upon determining that the temperature state is at an abnormal level.