US 12,107,386 B2
Assembly techniques and cooling manifold configuration for high-power laser systems
Matthew Sauter, Cambridge, MA (US); Bryan Lochman, Nashville, TN (US); Oscar Corripio, Wilmington, MA (US); and Bien Chann, Merrimack, NH (US)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD, Osaka (JP)
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD, Osaka (JP)
Filed on Nov. 25, 2020, as Appl. No. 17/104,485.
Claims priority of provisional application 62/942,768, filed on Dec. 3, 2019.
Claims priority of provisional application 62/982,832, filed on Feb. 28, 2020.
Prior Publication US 2021/0167575 A1, Jun. 3, 2021
Int. Cl. H01S 5/024 (2006.01); H01S 5/02218 (2021.01); H01S 5/0239 (2021.01); H01S 5/14 (2006.01)
CPC H01S 5/02423 (2013.01) [H01S 5/02218 (2021.01); H01S 5/0239 (2021.01); H01S 5/02438 (2013.01); H01S 5/146 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A laser resonator comprising:
a resonator housing defining an interior platform having a top surface and a bottom surface opposite the top surface, the platform defining a plurality of openings extending therethrough;
a plurality of base plates mechanically coupled to the top surface of the platform, wherein each base plate is disposed over at least a portion of one of the openings extending through the platform;
a plurality of beam emitters, each beam emitter being disposed over and coupled to one of the base plates; and
a cooling manifold coupled beneath the bottom surface of the platform, the cooling manifold defining a plurality of protrusions, wherein each protrusion extends upward into one of the openings in the platform to thereby define a fluid path extending from the cooling manifold, through the protrusion, and into the base plate disposed thereover.