| CPC H01S 5/0201 (2013.01) [H01S 5/0042 (2013.01); H01S 5/183 (2013.01)] | 9 Claims |
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1. An array device manufacturing method comprising the steps of:
forming a plurality of optical elements on a wafer;
inspecting the plurality of optical elements;
defining dicing lines on the basis of a result of the inspection such that an array device composed entirely of one or more non-defective ones of the plurality of optical elements is obtained, the one or more non-defective ones being determined to be non-defective in the inspection; and
forming the array device by dicing the wafer along the dicing lines, and
wherein the step of defining dicing lines is a step of defining the dicing lines such that assigning a first array device including more optical elements to a section of the wafer is prioritized over assigning a second array device including less optical elements to a section of the wafer.
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