an antenna pattern formed on a first substrate; and

a ground pattern formed on a second substrate disposed under the first substrate;

wherein the antenna pattern comprises:

a first metal pattern configured to be formed a metal having a length and width on an upper portion of the first substrate;

a second metal pattern spaced apart from the first metal pattern and formed as a metal having a length and width, wherein the first metal pattern and the second metal pattern include an inset region in which no metal pattern is formed;

a feeding pattern formed of a metal having a length and a width in the inset region and configured to feed a signal to be coupled to the first metal pattern and the second metal patterns; and

a plurality of vias configured to connect the first metal pattern and the second metal pattern to the ground pattern at end portions thereof and spaced inwardly apart from each other in a widthwise direction of the first metal pattern and the second metal pattern,

wherein each of the first metal pattern and the second metal pattern comprises:

a first radiation portion formed in a rectangular shape having a predetermined length and width, and having an inset region formed therein; and

a second radiation portion connected to the first radiation portion and formed to be tapered at a predetermined angle to increase a width.