US 12,107,328 B2
Electronic devices with interconnected ground structures
Siddharth Ravichandran, San Jose, CA (US); Puneeth Prahalad, Cupertino, CA (US); Vijaykrishnan Ramakrishnan, San Jose, CA (US); and Sathish Shanbhag Kota, San Jose, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 31, 2022, as Appl. No. 17/828,859.
Prior Publication US 2023/0387584 A1, Nov. 30, 2023
Int. Cl. H01Q 1/48 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 1/48 (2013.01) [H01Q 1/2291 (2013.01); H01Q 1/521 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An antenna comprising:
a first antenna ground structure;
a second antenna ground structure separated from the first antenna ground structure by a non-conductive gap; and
a conductive interconnect structure that extends across the non-conductive gap and couples the first antenna ground structure to the second antenna ground structure, the first antenna ground structure having a slot element and the conductive interconnect structure being coupled across the slot element, wherein the conductive interconnect structure provides a shorting path between the first antenna ground structure and the second antenna ground structure.