US 12,107,327 B2
Wiring board and method for manufacturing wiring board
Koichi Suzuki, Tokyo-to (JP); Seiji Take, Tokyo-to (JP); and Daisuke Matsuura, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
Filed on May 23, 2023, as Appl. No. 18/200,712.
Application 18/200,712 is a division of application No. 16/768,254, granted, now 11,705,624, previously published as PCT/JP2018/043909, filed on Nov. 29, 2018.
Claims priority of application No. 2017-229272 (JP), filed on Nov. 29, 2017; application No. 2018-045941 (JP), filed on Mar. 13, 2018; and application No. 2018-053281 (JP), filed on Mar. 20, 2018.
Prior Publication US 2023/0369751 A1, Nov. 16, 2023
Int. Cl. H05K 1/02 (2006.01); G01J 5/02 (2022.01); G01J 5/20 (2006.01); G01J 5/22 (2006.01); G01J 5/24 (2006.01); G02F 1/13 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 1/44 (2006.01); H01Q 3/02 (2006.01); H01Q 3/24 (2006.01); H01Q 3/26 (2006.01); H01Q 3/34 (2006.01); H01Q 7/00 (2006.01); H01Q 21/06 (2006.01); H01Q 21/12 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01)
CPC H01Q 1/36 (2013.01) [H05K 1/0274 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/0723 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a substrate having transparency; and
an antenna pattern region which is arranged on the substrate and includes a plurality of antenna wirings having a function as an antenna, wherein
the antenna pattern region comprises a widthwise central portion and a widthwise edge portion,
the antenna pattern region has a lattice shape or a mesh shape continuously along a width direction from the widthwise central portion to the widthwise edge portion, and
an aperture ratio of the widthwise central portion of the antenna pattern region is higher than an aperture ratio of the widthwise edge portion of the antenna pattern region.