an active device substrate, comprising a substrate, a first wire, and a second wire, wherein the first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and the first surface and the second surface are opposite to each other while a side surface of the substrate connects the first surface to the second surface;

an insulation film, configured on the side surface of the substrate;

a vertical wire, configured on a surface of the insulation film and located between the insulation film and the side surface of the substrate; and

an anisotropic conductive adhesive, configured between the vertical wire and the side surface of the substrate, and electrically connects the vertical wire to the first wire and the second wire.