US 12,107,139 B2
Semiconductor device
Guk Il An, Suwon-si (KR); Keun Hwi Cho, Goyang-si (KR); Dae Won Ha, Seoul (KR); and Seung Seok Ha, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 18, 2023, as Appl. No. 18/369,450.
Application 18/369,450 is a continuation of application No. 17/838,573, filed on Jun. 13, 2022, granted, now 11,799,013.
Application 17/838,573 is a continuation of application No. 17/176,226, filed on Feb. 16, 2021, granted, now 11,387,345, issued on Jul. 12, 2022.
Application 17/176,226 is a continuation of application No. 16/425,337, filed on May 29, 2019, granted, now 10,937,887, issued on Mar. 2, 2021.
Claims priority of application No. 10-2018-0078671 (KR), filed on Jul. 6, 2018; and application No. 10-2018-0133386 (KR), filed on Nov. 2, 2018.
Prior Publication US 2024/0014288 A1, Jan. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 29/51 (2006.01); H01L 23/522 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01); H01L 49/02 (2006.01)
CPC H01L 29/516 (2013.01) [H01L 23/5226 (2013.01); H01L 27/0886 (2013.01); H01L 28/40 (2013.01); H01L 29/785 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a substrate including an active region and a field region defining the active region;
a plurality of fin patterns disposed on the active region of the substrate and extending along in a first direction;
a gate structure on the plurality of fin patterns, the gate structure including a gate spacer and a gate electrode, the gate electrode extending in a second direction and having a first portion on the active region of the substrate and a second portion on the field region of the substrate;
a first conductive connection group on the gate electrode of the gate structure, the first conductive connection group including a ferroelectric material layer;
a source/drain pattern disposed on the plurality of fin patterns; and
a second conductive connection group connected to the source/drain pattern,
wherein at least a part of the ferroelectric material layer is disposed above an upper surface of the gate spacer,
wherein the first conductive connection group includes a gate contact plug being in contact with at least a portion of the first portion of the gate electrode, and
wherein a width of the gate contact plug in the second direction is smaller than a width of the first portion of the gate electrode in the second direction.