US 12,107,130 B2
Semiconductor device having semiconductor device elements in a semiconductor layer
Ingo Muri, Villach (AT); Johannes Konrad Baumgartl, Riegersdorf (AT); Oliver Hellmund, Neubiberg (DE); Jacob Tillmann Ludwig, Villach (AT); Iris Moder, Villach (AT); Thomas Neidhart, Klagenfurt (AT); Gerhard Schmidt, Wernberg-Wudmath (AT); and Hans-Joachim Schulze, Taufkirchen (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Apr. 21, 2021, as Appl. No. 17/235,989.
Application 17/235,989 is a division of application No. 16/406,773, filed on May 8, 2019, granted, now 11,038,028.
Claims priority of application No. 102018111213.0 (DE), filed on May 9, 2018.
Prior Publication US 2021/0265468 A1, Aug. 26, 2021
Int. Cl. H01L 29/36 (2006.01); H01L 21/02 (2006.01); H01L 21/223 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 29/167 (2006.01)
CPC H01L 29/36 (2013.01) [H01L 21/02236 (2013.01); H01L 21/02381 (2013.01); H01L 21/2236 (2013.01); H01L 21/2253 (2013.01); H01L 21/26513 (2013.01); H01L 29/167 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor substrate comprising a first dopant and a second dopant, wherein a covalent atomic radius of a material of the semiconductor substrate is i) larger than a covalent atomic radius of the first dopant and smaller than a covalent atomic radius of the second dopant, or ii) smaller than the covalent atomic radius of the first dopant and larger than the covalent atomic radius of the second dopant;
a semiconductor layer on the semiconductor substrate; and
semiconductor device elements in the semiconductor layer,
wherein a vertical concentration profile of the first dopant decreases along at least 80% of a distance between an interface of the semiconductor substrate and the semiconductor layer to a surface of the semiconductor substrate opposite to the interface,
wherein the vertical concentration profile N1(y) of the first dopant and a vertical concentration profile N2(y) of the second dopant satisfy:

OG Complex Work Unit Math
where t is a final thickness of the semiconductor substrate.