US 12,107,112 B2
Solid-state imaging device and electronic apparatus
Itaru Oshiyama, Kanagawa (JP); Shinichiro Noudo, Kumamoto (JP); and Yasufumi Miyoshi, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/282,420
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Aug. 20, 2019, PCT No. PCT/JP2019/032394
§ 371(c)(1), (2) Date Apr. 2, 2021,
PCT Pub. No. WO2020/075391, PCT Pub. Date Apr. 16, 2020.
Claims priority of application No. 2018-192693 (JP), filed on Oct. 11, 2018; and application No. 2019-073013 (JP), filed on Apr. 5, 2019.
Prior Publication US 2021/0384250 A1, Dec. 9, 2021
Int. Cl. H01L 27/146 (2006.01); H04N 25/76 (2023.01)
CPC H01L 27/14689 (2013.01) [H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/1463 (2013.01); H01L 27/1464 (2013.01); H01L 27/14643 (2013.01); H04N 25/76 (2023.01)] 20 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a substrate;
a plurality of photoelectric conversion portions formed on the substrate;
groove portions provided between adjacent photoelectric conversion portions;
a fixed charge film which covers a sidewall surface and a bottom surface of each of the groove portions; and
a light reception surface side of the substrate which contains at least one of hafnium, aluminum, zirconium, tantalum, and titanium,
wherein at least some of open ends of the groove portions are closed by the fixed charge film with a void left inside the groove portions,
wherein at least one corner portion among four corner portions located in diagonal directions with respect to respective directions in which the groove portions extend, formed on sidewall surfaces of the groove portions intersecting each other at an intersection portion in which the groove portions intersect each other is rounded in an arc shape, and
wherein a radius of curvature of the arc is equal to or smaller than 20 nm.