US 12,107,106 B2
Solid-state imaging device including groove with recessed and projecting sidewalls
Tomohiko Baba, Kanagawa (JP); and Naoki Hideshima, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/250,775
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Aug. 7, 2019, PCT No. PCT/JP2019/031065
§ 371(c)(1), (2) Date Mar. 2, 2021,
PCT Pub. No. WO2020/054272, PCT Pub. Date Mar. 19, 2020.
Claims priority of application No. 2018-169729 (JP), filed on Sep. 11, 2018; and application No. 2019-135147 (JP), filed on Jul. 23, 2019.
Prior Publication US 2021/0202561 A1, Jul. 1, 2021
Int. Cl. H01L 27/14 (2006.01); H01L 27/146 (2006.01)
CPC H01L 27/14632 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14645 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A solid-state imaging device, comprising:
a substrate on which a plurality of photoelectric conversion units has been formed;
a groove portion provided on a side of a light-receiving surface of the substrate; and
recessed and projecting portions provided on a side wall surface of the groove portion facing a side of the plurality of photoelectric conversion units.