US 12,107,105 B2
Method for defining a gap height within an image sensor package
Yu-Te Hsieh, Taoyuan (TW)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Oct. 16, 2023, as Appl. No. 18/487,611.
Application 18/487,611 is a continuation of application No. 16/948,792, filed on Oct. 1, 2020, granted, now 11,869,912.
Claims priority of provisional application 62/705,769, filed on Jul. 15, 2020.
Prior Publication US 2024/0038805 A1, Feb. 1, 2024
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14625 (2013.01) [H01L 27/14614 (2013.01); H01L 27/14634 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An image sensor package comprising:
a substrate;
an image sensor die coupled to the substrate;
a light transmitting member;
a plurality of pillar members disposed between and contacting the image sensor die and the light transmitting member, a height of the plurality of pillar members defining a gap height between an active region of the image sensor die and the light transmitting member; and
a bonding material that couples the light transmitting member to the image sensor die, the bonding material contacting a side of a pillar member, of the plurality of pillar members, that extends between a first end contacting the light transmitting member and a second end contacting the image sensor die.