US 12,107,102 B2
Anti-flare semiconductor packages and related methods
Shou-Chian Hsu, Zhubei (TW)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed on Aug. 1, 2023, as Appl. No. 18/363,296.
Application 18/363,296 is a continuation of application No. 17/305,616, filed on Jul. 12, 2021, granted, now 11,756,973.
Application 17/305,616 is a continuation of application No. 16/456,917, filed on Jun. 28, 2019, granted, now 11,063,078, issued on Jul. 13, 2021.
Prior Publication US 2023/0378208 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01)
CPC H01L 27/14623 (2013.01) [H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 21/56 (2013.01); H01L 24/95 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side;
a first side of an optically transmissive lid coupled to the second side of the semiconductor die;
a light block material comprised around the semiconductor package extending from the first side of the semiconductor die to a second side of the optically transmissive lid; and
an opening in the light block material on the second side of the optically transmissive lid;
wherein the light block material covers a portion of the second side of the optically transmissive lid and a portion of the first side of the semiconductor die.
 
8. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side;
a first side of an optically transmissive lid coupled to the second side of the semiconductor die; and
a light block material at least partially encapsulating the semiconductor package on six sides of the semiconductor package;
wherein the light block material is coupled directly over a second side of the optically transmissive lid opposite the first side of the optically transmissive lid.
 
15. A semiconductor package comprising:
a semiconductor die comprising a first side and a second side;
a first side of an optically transmissive lid coupled to the second side of the semiconductor die;
a light block material at least partially covering each side of the semiconductor package; and
an opening in the light block material on the second side of the optically transmissive lid that substantially corresponds with an active area of the semiconductor die.