US 12,107,101 B2
Package structure, packaging method, camera module, and electronic equipment
Kerui Xi, Shanghai (CN); Xuhui Peng, Shanghai (CN); Feng Qin, Shanghai (CN); Tingting Cui, Shanghai (CN); and Zhenyu Jia, Shanghai (CN)
Assigned to Shanghai AVIC OPTO Electronics Co., Ltd., Shanghai (CN); and Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai (CN)
Filed by Shanghai AVIC OPTO Electronics Co., Ltd., Shanghai (CN); and Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai (CN)
Filed on Dec. 9, 2021, as Appl. No. 17/546,740.
Claims priority of application No. 202110732770.5 (CN), filed on Jun. 30, 2021.
Prior Publication US 2022/0102406 A1, Mar. 31, 2022
Int. Cl. H01L 27/146 (2006.01); H01L 25/16 (2023.01)
CPC H01L 27/14618 (2013.01) [H01L 25/167 (2013.01); H01L 27/1462 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising a chip package module, wherein the chip package module comprises:
light-transmitting substrate;
a wiring layer located on a side of the light-transmitting substrate and comprising a first metal wire, wherein the wiring layer is directly formed on the side of the light-transmitting substrate in a form of film;
a conductor located on a side of the wiring layer facing away from the light-transmitting substrate, wherein the conductor comprises a first end electrically connected to the first metal wire, and a second end;
a photosensitive chip located on the side of the wiring layer facing away from the light-transmitting substrate, wherein the photosensitive chip comprises a pin electrically connected to the first metal wire and having a photosensitive surface configured to sense a photometric signal, and the photosensitive surface faces towards the light-transmitting substrate and comprises a photosensitive region that is not overlapping the first metal wire in a direction perpendicular to a principal plane of the light-transmitting substrate;
an active chip located on the side of the wiring layer facing away from the light-transmitting substrate and comprising a pin electrically connected to the first metal wire; and
an encapsulation layer that encapsulates the photosensitive chip and the active chip.