| CPC H01L 25/0657 (2013.01) [H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06593 (2013.01)] | 10 Claims |
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1. A stack package comprising:
a first semiconductor die disposed over a package substrate;
a supporter disposed over the package substrate and having a second side facing a first side of the first semiconductor die;
a second semiconductor die stacked over the first semiconductor die and over the supporter; and
an encapsulant layer filling a portion between the supporter and the first semiconductor die,
wherein the second side of the supporter is inclined with respect to the first side of the first semiconductor die, and
wherein the supporter comprises a third side connected to the second side, and a fourth side connecting the third side and the second side.
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