US 12,107,068 B2
Method and device for manufacturing stacked substrate
Hajime Mitsuishi, Tokyo (JP); and Isao Sugaya, Tokyo (JP)
Assigned to Nikon Corporation, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on May 27, 2020, as Appl. No. 16/885,041.
Application 16/885,041 is a continuation of application No. PCT/JP2018/039249, filed on Oct. 22, 2018.
Claims priority of application No. 2017-228012 (JP), filed on Nov. 28, 2017.
Prior Publication US 2020/0286851 A1, Sep. 10, 2020
Int. Cl. H01L 23/00 (2006.01); H01L 21/68 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 21/68 (2013.01); H01L 2224/80121 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method for manufacturing a stacked substrate comprising:
processing at least one of a plurality of substrates with a processing unit;
stacking at least two of the plurality of substrates with a stacking unit to manufacture the stacked substrate;
firstly measuring the stacked substrate;
secondly measuring the at least one of the plurality of substrates processed in the processing;
controlling the processing unit in accordance with a first correction condition calculated based on a measurement result in the firstly measuring and a measurement result in the secondly measuring, to process another at least one substrate different from the at least one of the plurality of substrates; and
controlling the stacking unit in accordance with a second correction condition calculated based on the measurement result in the firstly measuring and the measurement result in the secondly measuring, the second correction condition being different from the first correction condition, to stack another at least two substrates of the plurality of substrates different from the at least two of the plurality of substrates, wherein the another at least two substrates includes the another at least one substrate.