CPC H01L 24/78 (2013.01) [B23K 20/10 (2013.01); H01L 24/85 (2013.01); B23K 2101/40 (2018.08); H01L 24/48 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/78353 (2013.01); H01L 2224/7855 (2013.01); H01L 2224/789 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85947 (2013.01)] | 10 Claims |
1. A wire bonding device for performing a wire bonding process, the wire bonding device comprising:
a bonding tool including an insertion hole adapted for a wire to be inserted, the bonding tool configured to be movable;
an ultrasonic vibrator for supplying ultrasonic vibration to the bonding tool via an ultrasonic horn;
a control part, comprising one or more processors for controlling the wire bonding process,
wherein the control part is configured to perform:
a bonding step of bonding the wire to a bonding surface of a bonding point by pressing the wire with the bonding tool;
a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point;
a tension applying step of raising the bonding tool normal to the bonding surface to apply tension to the wire while the wire is clamped;
a tension release step of lowering the bonding tool normal to the bonding surface to release the tension applied to the wire; and
a tail cutting step of raising the bonding tool to cut the wire tail from the wire bonded to the bonding point, the tension applying step and the tension release step are performed consecutively for a plurality of times before the tail cutting step is performed.
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