US 12,107,065 B2
Uniform chip gaps via injection-molded solder pillars
Eric Peter Lewandowski, White Plains, NY (US); Jae-Woong Nah, Closter, NJ (US); and Dongbing Shao, Briarcliff Manor, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jul. 17, 2020, as Appl. No. 16/932,290.
Prior Publication US 2022/0020715 A1, Jan. 20, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 25/18 (2023.01); H10N 60/81 (2023.01)
CPC H01L 24/17 (2013.01) [H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 25/18 (2013.01); H10N 60/815 (2023.02); H01L 2224/1131 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/17177 (2013.01); H01L 2224/17179 (2013.01); H01L 2224/17505 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/014 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method, comprising:
electrically coupling at least one qubit chip to an interposer chip via one or more injection-molded solder interconnects;
forming one or more injection-molded solder pillars between the at least one qubit chip and the interposer chip, wherein the injection-molded solder pillars are in parallel with and outside on both sides of the one or more injection-molded solder interconnects;
forming a first plurality of under bump metallizations (UBMs) on the at least one qubit chip;
forming a second plurality of the UBMs on the interposer chip;
forming a third plurality of the UBMs on the interposer chip;
attaching the qubit chip to the interposer chip such that:
a plurality of the injection-molded solder interconnects are in contact with the first plurality of UBMs on a first end of the one or more injection-molded solder interconnects and in contact with the second plurality of UBMs on a second end of the one or more injection-molded solder interconnects; and
a plurality of the one or more injection-molded solder pillars are in contact with the third plurality of UBMs on a first end of the one or more injection-molded solder pillars, wherein the third plurality of UBMs is directly adjacent the interposer chip.