US 12,107,063 B2
Semiconductor package device
Ju-Il Choi, Seongnam-si (KR); Gyuho Kang, Cheonan-si (KR); Heewon Kim, Suwon-si (KR); Junyoung Park, Anyang-si (KR); Seong-Hoon Bae, Cheonan-si (KR); and Jin Ho An, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 17, 2021, as Appl. No. 17/204,313.
Claims priority of application No. 10-2020-0087594 (KR), filed on Jul. 15, 2020.
Prior Publication US 2022/0020714 A1, Jan. 20, 2022
Int. Cl. H01L 23/38 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01)
CPC H01L 24/14 (2013.01) [H01L 23/53238 (2013.01); H01L 23/5386 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13024 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor package device, comprising:
a redistribution substrate, the redistribution substrate including an under-bump pattern, an insulating layer, and an outer coupling terminal,
the under-bump pattern including a body portion and a protruding portion, the protruding portion extending from the body portion to form a single object along with the body portion, the body portion having a first diameter in a first direction parallel to a top surface of the redistribution substrate, the protruding portion having a second diameter in the first direction, the second diameter being smaller than the first diameter, a top surface of the protruding portion being parallel to the first direction, and a side surface of the protruding portion being inclined at an angle to a top surface of the body portion,
the insulating layer covering a side surface of the body portion, and
the outer coupling terminal being on the protruding portion, the protruding portion extending into the outer coupling terminal such that the outer coupling terminal surrounds an entire part of the side surface of the protruding portion, and a contact portion of the outer coupling terminal spaced apart from the body portion and directly contacting a lowermost surface of the insulating layer is lower than a level of a lowermost surface of the body portion and higher than a level of a lowermost surface of the protruding portion;
a diffusion prevention pattern between the under-bump pattern and the outer coupling terminal; and
a semiconductor chip on the top surface of the redistribution substrate,
wherein an entire part of the outer coupling terminal includes at least one of tin or silver,
wherein the diffusion prevention pattern comprises a metallic material different from a material of the under-bump pattern,
a thickness of the diffusion prevention pattern is smaller than a thickness of the under-bump pattern, and
wherein the outer coupling terminal is a solder ball.