US 12,107,060 B2
Microelectronic assemblies with inductors in direct bonding regions
Adel A. Elsherbini, Tempe, AZ (US); Zhiguo Qian, Chandler, AZ (US); Gerald S. Pasdast, San Jose, CA (US); Mohammad Enamul Kabir, Portland, OR (US); Han Wui Then, Portland, OR (US); Kimin Jun, Portland, OR (US); Kevin P. O'Brien, Portland, OR (US); Johanna M. Swan, Scottsdale, AZ (US); Shawna M. Liff, Scottsdale, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Feras Eid, Chandler, AZ (US)
Assigned to Intel Corproation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 18, 2020, as Appl. No. 17/025,843.
Prior Publication US 2022/0093547 A1, Mar. 24, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 49/02 (2006.01)
CPC H01L 24/08 (2013.01) [H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 28/10 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/09055 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/32145 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic assembly, comprising:
a first microelectronic component having a first direct bonding interface, wherein the first microelectronic component includes an inductor trace, and an interface portion of the inductor trace extends along the first direct bonding interface of the first microelectronic component; and
a second microelectronic component having a second direct bonding interface, wherein at least a portion of the second direct bonding interface is in direct contact with the interface portion of the inductor trace.