US 12,107,055 B2
Electronic package and fabrication method thereof
Chih-Hsun Hsu, Taichung (TW); Chi-Jen Chen, Taichung (TW); Hsi-Chang Hsu, Taichung (TW); Yuan-Hung Hsu, Taichung (TW); Rui-Feng Tai, Taichung (TW); and Don-Son Jiang, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Feb. 13, 2023, as Appl. No. 18/109,120.
Application 18/109,120 is a division of application No. 17/160,749, filed on Jan. 28, 2021, granted, now 11,610,850.
Claims priority of application No. 109141729 (TW), filed on Nov. 27, 2020.
Prior Publication US 2023/0187382 A1, Jun. 15, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 24/05 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/16227 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for fabricating an electronic package, comprising:
disposing a first electronic element and a second electronic element intervally on a carrier having a protective structure, wherein a space is formed between the first electronic element and the second electronic element, and the protective structure is positioned between the first electronic element and the second electronic element; and
forming a filling material on the carrier and in the space and encapsulating the protective structure.