US 12,107,047 B2
Apparatus and method for direct power delivery to integrated circuit package
Stephen Aubrey Scearce, Apex, NC (US); Louis Smidt, Gibsonia, PA (US); Kadin Stephens, Rosamond, CA (US); Victor Liu, San Ramon, CA (US); and Joel Richard Goergen, Soulsbyville, CA (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed on Jan. 11, 2021, as Appl. No. 17/145,871.
Prior Publication US 2022/0223522 A1, Jul. 14, 2022
Int. Cl. H01L 23/528 (2006.01); H01L 23/367 (2006.01); H01L 23/50 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/5286 (2013.01) [H01L 23/367 (2013.01); H01L 23/50 (2013.01); H01L 23/5386 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first cable;
a connecting member configured for positioning on an upper surface of an integrated circuit package, wherein the connecting member is attached to a first end of the first cable, and the connecting member is configured to position the first cable for connection to the upper surface of the integrated circuit package to deliver power from a power supply component to the integrated circuit package;
a second cable attached to the connecting member for delivering power from an additional power supply component to the integrated circuit package; and
a terminal for electrically coupling a second end of the first cable to the power supply component.