US 12,107,040 B2
Metal insulator metal (MIM) capacitor
Aaron J. Welsh, Portland, OR (US); Christopher M. Pelto, Beaverton, OR (US); David J. Towner, Portland, OR (US); Mark A. Blount, Portland, OR (US); Takayoshi Ito, Hillsboro, OR (US); Dragos Seghete, Portland, OR (US); Christopher R. Ryder, Portland, OR (US); Stephanie F. Sundholm, Hillsboro, OR (US); Chamara Abeysekera, Hillsboro, OR (US); Anil W. Dey, Portland, OR (US); Che-Yun Lin, Portland, OR (US); and Uygar E. Avci, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 21, 2020, as Appl. No. 17/129,858.
Claims priority of provisional application 63/072,822, filed on Aug. 31, 2020.
Claims priority of provisional application 63/072,814, filed on Aug. 31, 2020.
Prior Publication US 2022/0068794 A1, Mar. 3, 2022
Int. Cl. H01L 23/522 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01)
CPC H01L 23/5223 (2013.01) [H01L 28/60 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A metal-insulator-metal (MIM) capacitor, comprising:
a first electrode plate;
a first capacitor dielectric on the first electrode plate;
a second electrode plate on the first capacitor dielectric, the second electrode plate having a portion over and parallel with the first electrode plate;
a second capacitor dielectric on the second electrode plate;
a third electrode plate on the second capacitor dielectric, the third electrode plate having a portion over and parallel with the second electrode plate;
a third capacitor dielectric on the third electrode plate;
a fourth electrode plate on the third capacitor dielectric, the fourth electrode plate having a portion over and parallel with the third electrode plate;
a gasket laterally spaced apart from one of the first electrode plate, the second electrode plate, the third electrode plate, or the fourth electrode plate; and
a conductive via in contact with a sidewall of one or more of the first electrode plate, the second electrode plate, the third electrode plate or the fourth electrode plate, and the conductive via in contact with a sidewall of the gasket.