US 12,106,996 B2
Collet structure and semiconductor fabricating apparatus including the same
Jung Bum Woo, Gyeonggi-do (KR); Soo Hyuk Kim, Gyeonggi-do (KR); Byeong Ho Lee, Gyeonggi-do (KR); and Tae Hwan Lim, Gyeonggi-do (KR)
Assigned to SK hynix Inc., Gyeonggi-do (KR)
Filed by SK hynix Inc., Gyeonggi-do (KR)
Filed on Apr. 28, 2021, as Appl. No. 17/242,996.
Claims priority of application No. 10-2020-0130330 (KR), filed on Oct. 8, 2020.
Prior Publication US 2022/0115256 A1, Apr. 14, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/67144 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor fabricating apparatus including a collet structure configured to pick-up a semiconductor chip, the collet structure comprising:
a holder configured to receive a vacuum, the holder including a magnet arranged in the holder;
a plate including an upper surface magnetically and mechanically combined with the holder; and
an absorption member configured to make contact with the plate to pick-up the semiconductor chip using the vacuum provided from the plate,
wherein the holder comprises:
a shank disposed with the plate to match entire sidewalls of the shank to entire sidewalls of the plate;
a vacuum provider arranged over the shank, the vacuum provider including a first vacuum hole configured to transfer the vacuum; and
an edge contact configured to protrude from a bottom edge of the shank towards the plate by a first length, and
wherein a bottom surface of the edge contact is contacted with entire upper edges of the plate.