US 12,106,983 B2
Annealing device and annealing method
Teppei Tanaka, Kanagawa (JP)
Assigned to SUMITOMO HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed by SUMITOMO HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed on Jun. 2, 2021, as Appl. No. 17/336,932.
Application 17/336,932 is a continuation of application No. PCT/JP2019/045461, filed on Nov. 20, 2019.
Claims priority of application No. 2018-226435 (JP), filed on Dec. 3, 2018.
Prior Publication US 2021/0287921 A1, Sep. 16, 2021
Int. Cl. H01L 21/67 (2006.01); B23K 26/354 (2014.01); H01L 21/268 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67248 (2013.01) [B23K 26/354 (2015.10); H01L 21/268 (2013.01); H01L 21/67115 (2013.01); H01L 22/26 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An annealing device comprising:
a heating unit that heats a surface of an annealing object to temporarily melt an outer layer portion;
a sensor that detects thermal radiation light from the annealing object heated by the heating unit; and
a processing unit that estimates an annealing result of the annealing object on a basis of a waveform showing a temporal change in an intensity of the thermal radiation light detected by the sensor,
wherein the waveform includes a peak corresponding to a start of melting and a peak corresponding to complete solidification, and
the processing unit estimates a melting depth of the outer layer portion of the annealing object on a basis of a melting time from the peak to the peak.