US 12,106,906 B2
High voltage feed-through capacitor
Yuta Kamo, Tokyo (JP); and Hisashi Tanaka, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on Jul. 8, 2022, as Appl. No. 17/860,334.
Claims priority of application No. 2021-120351 (JP), filed on Jul. 21, 2021.
Prior Publication US 2023/0023226 A1, Jan. 26, 2023
Int. Cl. H01G 4/35 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/224 (2006.01); H01G 4/228 (2006.01)
CPC H01G 4/35 (2013.01) [H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/224 (2013.01); H01G 4/228 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A high voltage feed-through capacitor, comprising:
a feed-through capacitor unit;
a resin coating the feed-through capacitor unit; and
a bond structure between the feed-through capacitor unit and the resin, wherein
the feed-through capacitor unit includes
an element body including first and second principal surfaces opposing each other and being formed with a through hole to be open at the first and second principal surfaces; and
a first electrode disposed on the first principal surface;
a second electrode disposed on the second principal surface;
a through conductor inserted through the through hole and electrically connected to the first electrode; and
a terminal conductor electrically connected to the second electrode,
wherein the bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin, and
wherein the bond structure chemically bonds the first surface and the second surface via a silicon atom derived from a silane coupling agent.