US 12,106,905 B2
Ceramic electronic component including bonding layer between body and sintered external electrode
Bum Suk Kang, Suwon-si (KR); Su Jin Lee, Suwon-si (KR); Dae Woo Yoon, Suwon-si (KR); Da Mi Kim, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 29, 2022, as Appl. No. 17/707,390.
Claims priority of application No. 10-2021-0161325 (KR), filed on Nov. 22, 2021.
Prior Publication US 2023/0162921 A1, May 25, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A ceramic electronic component, comprising:
a body including a dielectric layer and an internal electrode;
a sintered external electrode disposed on the body; and
a bonding layer disposed on only a surface of the body in a region between the body and the sintered external electrode,
wherein the bonding layer has a thickness less than a thickness of the sintered external electrode,
wherein the bonding layer comprises silica (SiO2) or includes glass having a melting point of 500° C. or less, and
wherein a ratio of a thickness of the sintered external electrode at a center of the surface of the body, on which the sintered external electrode is disposed, to a thickness of the sintered external electrode at an edge of the surface of the body is 0.9 to 1.1.