CPC H01F 41/041 (2013.01) [H01F 5/003 (2013.01); H01F 5/06 (2013.01); H01F 41/127 (2013.01); H04N 23/54 (2023.01)] | 15 Claims |
1. A coil module comprising:
a conductor layer formed along a predetermined plane and including a wiring portion and a coil portion;
at least one element mounted on the wiring portion;
a first sealing resin;
a second sealing resin disposed on the first sealing resin in a first direction perpendicular to the plane; and
a plurality of terminal portions,
wherein the conductor layer is disposed on a surface of the first sealing resin that faces the second sealing resin,
the second sealing resin covers the conductor layer and the at least one element, the second sealing resin being integrally formed of a single type of resin material and having a predetermined thickness in the first direction,
each one of the terminal portions is electrically connected to the wiring portion or the coil portion and extends through the first sealing resin in the first direction to be exposed from a side of the first sealing resin that is opposite from the second sealing resin, and
the wiring portion and the coil portion are disposed at a same position in the first direction.
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