US 12,106,876 B2
Monolithic lead assembly and methods of microfabricating a monolithic lead assembly
Annapurna Karicherla, South San Francisco, CA (US); Bo Lu, South San Francisco, CA (US); and Kedar Shah, South San Francisco, CA (US)
Assigned to VERILY LIFE SCIENCES LLC, South San Francisco, CA (US)
Appl. No. 17/277,000
Filed by Verily Life Sciences LLC, South San Francisco, CA (US)
PCT Filed Sep. 13, 2019, PCT No. PCT/US2019/051165
§ 371(c)(1), (2) Date Mar. 17, 2021,
PCT Pub. No. WO2020/060881, PCT Pub. Date Mar. 26, 2020.
Claims priority of provisional application 62/732,666, filed on Sep. 18, 2018.
Prior Publication US 2022/0037054 A1, Feb. 3, 2022
Int. Cl. H01B 7/00 (2006.01); H01B 7/08 (2006.01); H01B 13/00 (2006.01); H05K 3/46 (2006.01); A61N 1/05 (2006.01); A61N 1/36 (2006.01)
CPC H01B 7/0892 (2013.01) [H01B 7/0823 (2013.01); H01B 7/0869 (2013.01); H01B 13/0013 (2013.01); H05K 3/4682 (2013.01); A61N 1/0551 (2013.01); A61N 1/36125 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A monolithic thin-film cable assembly comprising:
a proximal end;
a distal end;
a supporting structure that extends from the proximal end to the distal end, wherein the supporting structure is comprised of one or more layers of dielectric material;
a plurality of conductive traces formed on a portion of the supporting structure; and
a housing,
wherein the portion of the supporting structure has a spiral shape comprising two or more turns having a pitch between each of the turns in a range of 10 μm to 1 cm, and
wherein the housing completely encases at least a portion of the supporting structure and the one or more conductive traces and partially encases an electrode assembly.