US 12,106,869 B2
Busbar assembly and method for manufacturing the same
Yuusuke Adachi, Kyoto (JP)
Assigned to Suncall Corporation, Kyoto (JP)
Appl. No. 17/764,086
Filed by Suncall Corporation, Kyoto (JP)
PCT Filed Sep. 2, 2020, PCT No. PCT/JP2020/033212
§ 371(c)(1), (2) Date Mar. 25, 2022,
PCT Pub. No. WO2021/059904, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 2019-177285 (JP), filed on Sep. 27, 2019.
Prior Publication US 2022/0359101 A1, Nov. 10, 2022
Int. Cl. H01B 5/02 (2006.01); B23K 26/0622 (2014.01); B23K 26/38 (2014.01); H01B 13/00 (2006.01)
CPC H01B 5/02 (2013.01) [B23K 26/0622 (2015.10); B23K 26/38 (2013.01); H01B 13/0036 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A busbar assembly comprising:
first and second busbars formed by a conductive flat plate member and disposed in a common plane with a gap provided therebetween;
an insulative resin layer including a gap filling part filled into the gap and an upper surface laminated part provided on an upper surface on one side in a plate thickness direction of a busbar connecting body in which the first and second busbars are connected to each other by the gap filling part;
the upper surface laminated part having a first busbar-side upper surface opening that exposes a predetermined area out of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area out of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween; and
a part of the upper surface laminated part that is positioned between the first and second busbar-side upper surface openings forming a partitioning wall;
wherein the insulating resin layer has a lower surface laminated part provided on a lower surface on the other side of the busbar connecting body in the thickness direction, and a side surface laminated part provided on a side surface of the busbar connecting body and connecting peripheral edges of the upper surface laminated part and the lower surface laminated part, and
wherein the lower surface laminated part having a lower surface opening that exposes a predetermined area of the lower surfaces of the first and second busbars.
 
5. A method for manufacturing a busbar assembly including first and second busbars formed by a conductive flat plate member and disposed in a common plane with a gap provided between adjacent busbars, and an insulating resin layer including a gap filling part filled into the gap, an upper surface laminated part provided on an upper surface on one side in a plate thickness direction of a busbar connecting body in which the first and second busbars are connected to each other by the gap filling part, a lower surface laminated part provided on a lower surface on the other side of the busbar connecting body in the thickness direction, and a side surface laminated part provided on a side surface of the busbar connecting body and connecting peripheral edges of the upper surface laminated part and the lower surface laminated part, wherein the upper surface laminated part has a first busbar-side upper surface opening that exposes a predetermined area out of the upper surfaces of the first busbar and the gap filling part that straddles a boundary therebetween, and a second busbar-side upper surface opening that exposes a predetermined area out of the upper surfaces of the second busbar and the gap filling part that straddles a boundary therebetween, and a part of the upper surface laminated part that is positioned between the first and second busbar-side upper surface openings forms a partitioning wall, and wherein the lower surface laminated part has a lower surface opening that exposes a predetermined area of the lower surfaces of the first and second busbars, the method comprising:
a process of preparing a busbar-directed conductive metal flat plate having a busbar assembly forming area that forms the first and second busbars;
a slit forming process of forming, in the busbar assembly forming area, a slit penetrating between an upper surface on one side and a lower surface on the other side in the thickness direction and having a width same as the gap so as to define first and second busbar forming sites corresponding to the first and second busbars;
a process of providing an insulative resin material in the slit and on an entirety of the upper surface, the lower surface and a side surface of the busbar assembly forming area;
a process of curing the insulative resin material to form the insulating resin layer including the gap filling part the upper surface laminated part, the lower surface laminated part and the side surface laminated part;
a laser beam irradiating process of irradiating a laser beam to areas out of the upper surface of the upper surface laminated part that correspond to the first and second busbar-side upper surface openings to form the first and second busbar-side upper surface openings and irradiating a laser beam to the predetermined area of the lower surface laminated part to form the lower surface opening; and
a cutting process of cutting the busbar assembly forming area from the busbar-directed conductive metal flat plate,
wherein the laser beam irradiating process is configured to repeat a laser irradiating operation several times, the laser irradiating operation including a large pulse width laser irradiating operation in which the entirety of the corresponding area is irradiated with a large pulse width laser and a small pulse width laser irradiating operation in which the entirety of the corresponding area is irradiated with a small pulse width laser.
 
8. A busbar assembly comprising:
first and second busbars formed by a conductive flat plate member and disposed in a common plane with a gap provided therebetween;
an insulative resin layer including a gap filling part filled into the gap, an upper surface laminated part provided on an upper surface on one side in a plate thickness direction of a busbar connecting body in which the first and second busbars are connected to each other by the gap filling part, a lower surface laminated part provided on a lower surface on the other side of the busbar connecting body in the thickness direction, and a side surface laminated part provided on a side of the busbar connecting body and connecting peripheral edges of the upper surface laminated part and the lower surface laminated part;
the upper surface laminated part having first and second busbar-side upper surface openings that respectively expose parts of the upper surfaces of the first and second busbars;
the lower surface laminated part having first and second busbar-side lower surface openings that respectively expose predetermined areas of the lower surfaces of the first and second busbars respectively.
 
9. A busbar assembly comprising:
first and second busbars formed by a conductive flat plate member and disposed in a common plane with a gap provided therebetween;
an insulative resin layer including a gap filling part filled into the gap, an upper surface laminated part provided on an upper surface on one side in a plate thickness direction of a busbar connecting body in which the first and second busbars are connected to each other by the gap filling part, a lower surface laminated part provided on a lower surface on the other side of the busbar connecting body in the thickness direction, and a side surface laminated part provided on a side of the busbar connecting body and connecting peripheral edges of the upper surface laminated part and the lower surface laminated part;
the upper surface laminated part having first and second busbar-side upper surface openings that respectively expose parts of the upper surfaces of the first and second busbars; and the lower surface laminated part having a single lower surface opening that integrally exposes both of the predetermined areas of the lower surfaces of the first and second busbars.
 
10. A busbar assembly comprising:
first and second busbars formed by a conductive flat plate member and disposed in a common plane with a gap provided therebetween;
an insulative resin layer including a gap filling part filled into the gap and an upper surface laminated part provided on an upper surface on one side in a plate thickness direction of a busbar connecting body in which the first and second busbars are connected to each other by the gap filling part;
the first and second busbars each having the upper surface on one side in the plate thickness direction, a lower surface on the other side in the plate thickness direction, a first side surface that faces the gap, a second side surface that turns to the opposite side of the gap, a third side surface that connects end portions of the upper surface, the lower surface, the first side surface and the second side surface that are positioned on one side of the gap in the longitudinal direction, and a fourth side surface that connects end portions of the upper surface, the lower surface, the first side surface and the second side surface that are positioned on the other side of the gap in the longitudinal direction;
the first side surface having an upper surface adjacent section that extends from the upper surface to the other side in the thickness direction, a step section that extends, from an end portion of the upper surface adjacent section that is positioned on the other side in the thickness direction, in a direction proximate to the second side surface, and a lower adjacent section that extends, from an end portion of the step section that is positioned on a side proximate to the second side surface, to the other side in the thickness direction to reach the lower surface;
the second side surface having an upper surface adjacent section that extends from the upper surface to the other side in the thickness direction, a step section that extends, from an end portion of upper surface adjacent section that is positioned on the other side in the thickness direction, in a direction proximate to the first side surface, and a lower surface adjacent section that extends, from an end portion of the step section that is positioned on a side proximate to the first side surface, to the other side in the thickness direction to reach the lower surface;
the upper surface laminated part having first and second busbar-side upper surface openings that respectively expose parts of the upper surfaces of the first and second busbars; and
the insulating resin layer having the gap filling part and the upper surface laminated part, and also having a side surface laminated part integrally formed with the upper surface laminated part in such a manner as to cover the side surfaces of the busbar connecting body while exposing the lower surfaces of the first and second busbars.