	US 12,106,786 B2
	Magnetic head, head gimbal assembly, hard disk drive, and method for processing magnetic head
Ryuji Fujii, Hong Kong (CN); Shi Xiong Chen, Hong Kong (CN); Zeng Hui Zhang, Hong Kong (CN); Yong Lei, Hong Kong (CN); and Yong Jun Zhang, Hong Kong (CN)
Assigned to SAE MAGNETICS (H.K.) LTD., Hong Kong (CN)
Filed by SAE Magnetics (H.K.) Ltd., Hong Kong (CN)
Filed on Nov. 1, 2022, as Appl. No. 17/978,480.
Claims priority of application No. 202210914728.X (CN), filed on Aug. 1, 2022.
Prior Publication US 2024/0038261 A1, Feb. 1, 2024
Int. Cl. G11B 5/31 (2006.01); G11B 5/127 (2006.01); G11B 5/49 (2006.01)

CPC G11B 5/3169 (2013.01) [G11B 5/1276 (2013.01); G11B 5/3173 (2013.01); G11B 5/49 (2013.01)]

3 Claims

1. A method for processing a magnetic head, the magnetic head comprising a substrate and a thin-film magnetic head formed at an end of the substrate, the thin-film magnetic head comprising a read/write part and a bonding pad part proximate to the read/write part, the read/write part is in the form of a protruding part and is arranged on an air bearing surface opposite to a storage medium, and the read/write part has a write head for writing information in the storage medium and a read head for reading information from the storage medium; the bonding pad part comprises a welding contact point formed on an end surface of the thin-film magnetic head, wherein the method for processing the magnetic head comprises:

irradiating at a fixed point proximate to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded to produce target expansion;

orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar, so that the heights of the read head and the write head of each of the plurality of magnetic heads meet their respective target values; and

disassembling the magnetic strip to obtain a lapped magnetic head;

wherein the step of irradiating at the fixed point proximate to the read/write part with the laser irradiation device until the read head and the write head are thermally expanded comprises:

irradiating the bonding pad part at the fixed point with the laser irradiation device until the heated welding contact point transfers heat to the read head and the write head, resulting in thermal expansion of the read head and the write head; and

wherein the irradiating of the bonding pad part at the fixed point with the laser irradiation device comprises: irradiating the welding contact point located at a preset distance from the write head with the laser irradiating device, wherein the preset distance is 10 μm to 20 μm.