US 12,105,585 B2
Method of equalizing bit error rates of memory device
Eun-chu Oh, Hwaseong-si (KR); Moo-sung Kim, Yongin-si (KR); Young-sik Kim, Suwon-si (KR); Yong-jun Lee, Hwaseong-si (KR); and Jeong-ho Lee, Gwacheon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 17, 2021, as Appl. No. 17/478,597.
Application 17/478,597 is a continuation of application No. 16/358,884, filed on Mar. 20, 2019, granted, now 11,126,497.
Claims priority of application No. 10-2018-0065658 (KR), filed on Jun. 7, 2018.
Prior Publication US 2022/0004455 A1, Jan. 6, 2022
Int. Cl. G06F 11/10 (2006.01); G06F 11/07 (2006.01); G11C 13/00 (2006.01); G11C 29/52 (2006.01)
CPC G06F 11/1044 (2013.01) [G06F 11/076 (2013.01); G06F 11/1068 (2013.01); G11C 13/0004 (2013.01); G11C 13/0035 (2013.01); G11C 13/0069 (2013.01); G11C 29/52 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A memory system comprising:
a memory device including a control circuit and a memory cell array that includes a plurality of memory cells disposed at intersections between a plurality of word lines and a plurality of bit lines; and
a memory controller configured to control the memory device and including an error correction code (ECC) circuit that is configured to perform an ECC encoding on write data and an ECC decoding on read data,
wherein the ECC circuit is configured to perform the ECC encoding on the write data to generate a codeword including a first sector and a second sector, and to provide the codeword to the memory device,
wherein the control circuit is configured to perform an ECC interleaving operation on the codeword such that the first sector is written to a first portion of the memory cell array and the second sector is written to a second portion of the memory cell array,
wherein the first portion of the memory cell array has a first bit error rate (BER) and the second portion of the memory cell array has a second bit error rate (BER) that is lower than the first BER,
wherein the memory device is a resistive random access memory (RRAM), a magnetoresistive random access memory (MRAM) or a phase-change random access memory (PRAM),
wherein the plurality of memory cells are resistive type memory cells,
wherein each of the plurality of memory cells includes a variable resistor including an upper electrode, a lower electrode and a dielectric between the upper electrode and the lower electrode,
wherein the memory cell array includes a plurality of memory tiles including a first tile and a second tile, and
wherein the first portion of the memory cell array includes opposite edge portions of the first tile and the second tile, and the second portion of the memory cell array includes portions of the first tile and the second tile respectively between the opposite edge portions of the first tile and the second tile.