US 12,105,145 B2
Scan compression through pin data encoding
Sandeep Jain, Noida (IN); and Shalini Pathak, Gurgaon (IN)
Assigned to STMicroelectronics International N.V., Geneva (CH)
Filed by STMicroelectronics International N.V., Geneva (CH)
Filed on Jul. 31, 2023, as Appl. No. 18/362,550.
Application 18/362,550 is a continuation of application No. 17/747,331, filed on May 18, 2022, granted, now 11,782,092.
Prior Publication US 2023/0375617 A1, Nov. 23, 2023
Int. Cl. G01R 31/3185 (2006.01); G01R 31/317 (2006.01); G01R 31/3183 (2006.01)
CPC G01R 31/318536 (2013.01) [G01R 31/317 (2013.01); G01R 31/318335 (2013.01); G01R 31/31853 (2013.01); G01R 31/318533 (2013.01); G01R 31/318555 (2013.01); G01R 31/318558 (2013.01); G01R 31/318566 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for testing a chip, the method comprising:
specifying a first pin assignment with N input pins and R merged input pins, N and R being integers, N corresponding to a number of input pins for carrying scan-in chain test data, and R corresponding to a number of input pins for carrying a merged expected test result and a masking instruction signal;
specifying a second pin assignment with N input pins and M output pins, M being an integer and corresponding to a number of output pins for carrying scan-out chain test data;
generating an N by M codec;
integrating the N by M codec and inserting scan chains, wherein device registers are stitched into multiple scan chains and coupled between a compression circuit and a decompression circuit;
decoding output signals from the merged expected test result and the masking instruction signal received from the R merged input pins;
receiving the scan-in chain test data; and
comparing the decoded output signals comprising an expected test result with a test result chain.