	US 12,105,141 B2
	Structure and method for testing of PIC with an upturned mirror
Lucas Soldano, San Jose, CA (US); Jing Yang, Singapore (SG); Yong Meng Lee, San Jose, CA (US); and Suresh Venkatesan, San Jose, CA (US)
Filed by POET Technologies, Inc., San Jose, CA (US)
Filed on Apr. 28, 2021, as Appl. No. 17/242,686.
Claims priority of provisional application 63/016,535, filed on Apr. 28, 2020.
Prior Publication US 2021/0356518 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/311 (2006.01); G01R 31/28 (2006.01); G02B 6/42 (2006.01)

CPC G01R 31/311 (2013.01) [G01R 31/2886 (2013.01); G02B 6/4214 (2013.01)]

20 Claims

1. A sacrificial upturned mirror comprising

a reflective layer disposed on a mirror base on a substrate,

wherein the mirror base comprises a mirror profile configured to reflect a first optical signal from a waveguide,

wherein the waveguide is fabricated on a surface of the substrate

wherein the first optical signal is configured to reflect upward, in a direction perpendicular to the substrate, out of the surface of the substrate from the waveguide,

wherein the waveguide is coupled to an optoelectronic circuit,

wherein the optoelectronic circuit is configured to emit the first optical signal to the waveguide to the sacrificial upturned mirror,

wherein the sacrificial upturned mirror is configured for testing the optoelectronic circuit,

wherein the testing is performed using a tester comprising an electrical probe head and an optical probe head with the electrical probe head configured to contact the substrate and the optical probe head configured to be disposed above the substrate,

wherein the electrical probe head comprises multiple electrical probes,

wherein the multiple electrical probes are configured to contact multiple terminal pads of the optoelectronic circuit during the testing process,

wherein the optical probe head comprises an optical detector,

wherein the optical detector is configured to be aligned with the sacrificial upturned mirror for receiving a second optical signal generated by the optoelectronic circuit during the testing process,

wherein the sacrificial upturned mirror is configured to transmit the second optical signal in a direction perpendicular to the substrate to the optical detector,

wherein the tester is configured to process the second optical signal for testing the optoelectronic circuit,

wherein the sacrificial upturned mirror is configured to be removed in a subsequent fabrication step after the testing step.