US 12,105,132 B2
Electric field measuring apparatus and method of measuring electric field using the same
Jinyeong Yun, Yongin-si (KR); Meehyun Lim, Seoul (KR); Sungjin Kim, Suwon-si (KR); Masahiko Yamabe, Hwaseong-si (KR); Sungyeol Kim, Yongin-si (KR); Sungyong Lim, Seoul (KR); and Sunghwi Cho, Gwangju-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Oct. 27, 2022, as Appl. No. 17/975,202.
Claims priority of application No. 10-2021-0184295 (KR), filed on Dec. 21, 2021.
Prior Publication US 2023/0194591 A1, Jun. 22, 2023
Int. Cl. G01R 29/12 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC G01R 29/12 (2013.01) [H01L 21/6833 (2013.01); H01L 21/68742 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electric field measuring apparatus comprising:
an electrostatic chuck provided with a through hole and configured to hold a wafer using an electrostatic force;
a lift pin configured to pick up the wafer and vertically move through the through hole;
a driver configured to vertically move the lift pin along the through hole;
a probe in the lift pin and having a refractive index changed by an electric field of the wafer, the probe including an electro-optical crystal;
an optical waveguide configured to form at least one internal path of light having a polarization characteristic changed by the changed refractive index between the probe and the wafer; and
a control module configured to control the lift pin and the driver,
wherein the lift pin is further configured to move to a first position and a second position at a different vertical level than the first position,
wherein each of the first and second positions is at a lower vertical level than the wafer, and
wherein the control module is further configured to calculate a strength of the electric field of the wafer, using electric field data measured using the probe at each of the first and second positions.