	US 12,104,970 B2
	Pressure sensing device, pressure sensing method and equipment with temperature compensation
Hao Li, Guangdong (CN); and Xuepeng Lin, Guangdong (CN)
Assigned to SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD., Shenzhen (CN)
Appl. No. 17/639,247
Filed by SHENZHEN NEW DEGREE TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Aug. 30, 2019, PCT No. PCT/CN2019/103866 § 371(c)(1), (2) Date Feb. 28, 2022, PCT Pub. No. WO2021/035743, PCT Pub. Date Mar. 4, 2021.
Prior Publication US 2022/0334011 A1, Oct. 20, 2022
Int. Cl. G01L 1/22 (2006.01)

CPC G01L 1/2281 (2013.01) [G01L 1/2262 (2013.01); G01L 1/2293 (2013.01)]

13 Claims

1. A pressure sensing device, comprising:

a rigid structure, configured to be attached to a measured object and be deformed following deformation of the measured object, and comprising:

rigid blocks, arranged at intervals along a predetermined direction; and

strain amplification zones, each of which is formed between adjacent pairs of the rigid blocks,

wherein the rigid structure has first and second installation surfaces arranged opposite to each other, and one of the first and second installation surfaces serves as a contact surface with the measured object; and

force sensors, comprising:

first sensors, arranged in the strain amplification zones and capable of following the deformation of the measured object; and

second sensors, arranged on the rigid blocks and located adjacent to corresponding first sensors,

wherein an output signal of each of the second sensors serves as a temperature compensation amount of a corresponding first sensor; at least one of the first sensors is respectively arranged on each of the first and second installation surfaces of the strain amplification zones; at least one of the second sensors is respectively arranged on each of the first and second installation surfaces of the rigid blocks; and wherein at least four of the force sensors are connected to form a bridge circuit electrically connected to a signal processing circuit to detect the deformation of the rigid structure and to obtain a force acting on the measured object,

wherein, for at least one of the strain amplification zones formed between the adjacent pairs of the rigid blocks, a full-bridge circuit is provided to implement pressure detection, and another full-bridge circuit is provided to implement temperature compensation;

or alternatively, for the at least one of the strain amplification zones formed between the adjacent pairs of the rigid blocks, a half-bridge circuit is provided to implement the pressure detection and the temperature compensation;

or alternatively, for the at least one of the strain amplification zones formed between the adjacent pairs of the rigid blocks, a full bridge circuit is provided to implement the pressure detection, and a half bridge is added to implement the temperature compensation;

or alternatively, for at least two of the strain amplification zones and the corresponding adjacent pairs of the rigid blocks, a first strain amplification zone is provided with a full bridge circuit to implement the pressure detection, and another full bridge circuit to implement the temperature compensation, and a second strain amplification zone is provided with another full bridge circuit to implement the pressure detection, and a half bridge circuit to implement the temperature compensation.