US 12,104,925 B2
Sensor device
Moriyuki Shimizu, Yokkaichi (JP); Kyungwoo Kim, Yokkaichi (JP); Toshinari Kobayashi, Yokkaichi (JP); Hironobu Yamamoto, Yokkaichi (JP); and Yukitoshi Terasaka, Yokkaichi (JP)
Assigned to Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
Appl. No. 17/756,409
Filed by Sumitomo Wiring Systems, Ltd., Yokkaichi (JP)
PCT Filed Nov. 12, 2020, PCT No. PCT/JP2020/042241
§ 371(c)(1), (2) Date May 24, 2022,
PCT Pub. No. WO2021/106598, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-214318 (JP), filed on Nov. 27, 2019.
Prior Publication US 2023/0003559 A1, Jan. 5, 2023
Int. Cl. G01D 11/24 (2006.01)
CPC G01D 11/245 (2013.01) 6 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a sensor element; and
a resin cover part that covers the sensor element, wherein the resin cover part includes (i) a primary molded part that holds the sensor element, and (ii) a secondary molded part that covers the primary molded part,
wherein at least a portion of a surface of the resin cover part is cross-linked and at least a portion of a surface of the secondary molded part is cross-linked.