| CPC C25D 17/004 (2013.01) [C25D 17/001 (2013.01); C25D 17/007 (2013.01)] | 19 Claims |
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1. A plating apparatus comprising:
a body including a cathode;
a lip seal structure connected to the body and configured to hold a wafer,
the lip seal structure including a bottom portion, a contact portion connected to the bottom portion and configured to contact the wafer, and at least one partition structure protruding from an upper surface of the bottom portion; and
a conductive liquid covering the upper surface of the bottom portion, the conductive liquid being configured to electrically connect the cathode and the wafer to each other,
wherein the conductive liquid contacts both sidewalls of the partition structure,
the at least one partition structure includes a first partition structure having a plurality of first openings and a second partition structure including a plurality of second openings,
the second partition structure is adjacent to the first partition structure, and
the plurality of first openings and the plurality of second openings are misaligned with each other in a circumferential direction.
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