US 12,104,099 B2
Bonded structure and method for producing same
Masami Saito, Kariya (JP); Koji Kondo, Kariya (JP); and Hirotaka Miyano, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on Jul. 7, 2021, as Appl. No. 17/369,743.
Application 17/369,743 is a continuation of application No. PCT/JP2019/043575, filed on Nov. 7, 2019.
Claims priority of application No. 2019-001657 (JP), filed on Jan. 9, 2019.
Prior Publication US 2021/0332267 A1, Oct. 28, 2021
Int. Cl. C09J 5/02 (2006.01); C09J 5/06 (2006.01); C09J 163/00 (2006.01); F16B 11/00 (2006.01)
CPC C09J 5/02 (2013.01) [C09J 5/06 (2013.01); C09J 163/00 (2013.01); C09J 2400/146 (2013.01); C09J 2400/163 (2013.01); F16B 11/006 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a first substrate comprising aluminum or an aluminum alloy;
a first thin film layer formed on a surface of the first substrate; and
a resin adhesive layer bonded to a surface of the first thin film layer,
wherein the first thin film layer comprises silicate glass comprising a metal element with different valency from Si, as a solid solution,
the resin adhesive layer comprises a resin comprising a structural site derived from ionic polymerization or a resin capable of dehydration condensation,
the first thin film layer and the resin adhesive layer are bonded by ionic bonds or covalent bonds, and
the first thin film layer includes a Ca content which is 5% by mass or less.