US 12,104,087 B2
Composition for chemical-mechanical polishing and chemical-mechanical polishing method
Yuuya Yamada, Tokyo (JP); Pengyu Wang, Tokyo (JP); Norihiko Sugie, Tokyo (JP); and Yasutaka Kamei, Tokyo (JP)
Assigned to JSR CORPORATION, Tokyo (JP)
Appl. No. 17/775,887
Filed by JSR CORPORATION, Tokyo (JP)
PCT Filed Oct. 12, 2020, PCT No. PCT/JP2020/038480
§ 371(c)(1), (2) Date May 11, 2022,
PCT Pub. No. WO2021/095414, PCT Pub. Date May 20, 2021.
Claims priority of application No. 2019-206905 (JP), filed on Nov. 15, 2019.
Prior Publication US 2022/0389279 A1, Dec. 8, 2022
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01); C09K 13/00 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1436 (2013.01); C09K 13/00 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A composition for chemical-mechanical polishing comprising
(A) silica particles having a functional group represented by general formula (1) below, and
(B) a silane compound,
—COO−M+  (1)
wherein M+ represents a monovalent cation,
a content of the component (B) is 0.0001% by mass or more and 0.02% by mass or less.