US 12,104,054 B2
Resin composition, prepreg containing same, laminate, and printed circuit board
Liexiang He, Guangdong (CN); Yongnian Qi, Guangdong (CN); Xianping Zeng, Guangdong (CN); Zhongqiang Yang, Guangdong (CN); and Hualin Pan, Guangdong (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., (CN)
Appl. No. 17/437,555
Filed by SHENGYI TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Apr. 8, 2019, PCT No. PCT/CN2019/081741
§ 371(c)(1), (2) Date Sep. 9, 2021,
PCT Pub. No. WO2020/186571, PCT Pub. Date Sep. 24, 2020.
Claims priority of application No. 201910206965.9 (CN), filed on Mar. 18, 2019.
Prior Publication US 2022/0153989 A1, May 19, 2022
Int. Cl. C08L 63/04 (2006.01); C08J 5/24 (2006.01); C08K 3/013 (2018.01); C08K 5/00 (2006.01)
CPC C08L 63/04 (2013.01) [C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/013 (2018.01); C08K 5/0066 (2013.01); C08J 2363/04 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01)] 10 Claims
 
1. A resin composition, comprising:
100 parts by weight of a halogen-free epoxy resin,
11-37 parts by weight of an active ester resin, and
40-66 parts by weight of a compound represented by Formula (I),

OG Complex Work Unit Chemistry
wherein n is 2-15; Ac represents an acetyl group;
wherein the active ester resin is a compound represented by Formula (II)

OG Complex Work Unit Chemistry
wherein X represents a phenyl group or a naphthyl group; j is 0 or 1; k is 0 or 1; n is 0.25-1.25;
wherein the active ester resin has a number average molecular weight of less than 800.