US 12,103,999 B2
Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board
Akihiro Nakamura, Tokyo (JP); Yuji Takase, Tokyo (JP); Hayato Sawamoto, Tokyo (JP); Yoshikazu Suzuki, Tokyo (JP); Shuji Nomoto, Tokyo (JP); and Shota Okade, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/440,499
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed May 25, 2020, PCT No. PCT/JP2020/020614
§ 371(c)(1), (2) Date Sep. 17, 2021,
PCT Pub. No. WO2020/241595, PCT Pub. Date Dec. 3, 2020.
Claims priority of application No. 2019-102945 (JP), filed on May 31, 2019.
Prior Publication US 2022/0169772 A1, Jun. 2, 2022
Int. Cl. C08F 290/14 (2006.01); G03F 7/031 (2006.01); H01L 23/14 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01)
CPC C08F 290/144 (2013.01) [G03F 7/031 (2013.01); H01L 23/145 (2013.01); H05K 1/032 (2013.01); H05K 3/4676 (2013.01); H05K 1/0373 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A photosensitive resin composition comprising a plurality of components, the components comprising at least:
(A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent,
(B) a photopolymerization initiator,
(D) a thermosetting resin, and
(G) an elastomer, wherein
at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure, and
the thermosetting resin (D) comprises a tetramethyl biphenol type epoxy resin.