US 12,103,246 B2
Method of bonding substrates, microchip and method of manufacturing the same
Motohiro Sakai, Tokyo (JP); Shinji Suzuki, Tokyo (JP); Fumitoshi Takemoto, Tokyo (JP); and Kenichi Hirose, Tokyo (JP)
Assigned to USHIO DENKI KABUSHIKI KAISHA, Tokyo (JP)
Filed by USHIO DENKI KABUSHIKI KAISHA, Tokyo (JP)
Filed on Nov. 15, 2017, as Appl. No. 15/814,267.
Claims priority of application No. 2016-225765 (JP), filed on Nov. 21, 2016.
Prior Publication US 2018/0141280 A1, May 24, 2018
Int. Cl. B29C 65/74 (2006.01); B29C 35/08 (2006.01); B29C 59/14 (2006.01); B29C 59/16 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29C 65/14 (2006.01); B29L 11/00 (2006.01); B29L 31/00 (2006.01); B81C 3/00 (2006.01); C09J 5/02 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); H01L 21/67 (2006.01)
CPC B29C 65/7415 (2013.01) [B29C 59/14 (2013.01); B29C 59/16 (2013.01); B29C 65/1406 (2013.01); B29C 65/1432 (2013.01); B29C 66/028 (2013.01); B29C 66/1122 (2013.01); B29C 66/53461 (2013.01); B29C 66/54 (2013.01); B29C 66/83221 (2013.01); B81C 3/001 (2013.01); C09J 5/02 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/67005 (2013.01); B29C 2035/0827 (2013.01); B29C 65/02 (2013.01); B29C 66/232 (2013.01); B29C 66/30223 (2013.01); B29C 66/534 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/73366 (2013.01); B29C 66/7465 (2013.01); B29C 66/919 (2013.01); B29C 66/92445 (2013.01); B29C 66/929 (2013.01); B29C 66/949 (2013.01); B29L 2011/00 (2013.01); B29L 2011/0016 (2013.01); B29L 2031/756 (2013.01); C09J 2400/143 (2013.01); C09J 2400/146 (2013.01); C09J 2400/163 (2013.01); C09J 2400/166 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A microchip having a flow channel in which a medium flows, the microchip comprising:
a first substrate and a second substrate bonded directly to each other without any adhesive agent intervening or a solvent bonded interface between the substrates, each of the first substrate and the second substrate being made of glass or a resin;
a plurality of joining regions provided on at least one of a joining surface of the first substrate and a joining surface of the second substrate;
a plurality of flow channel forming portions each arranged within at least one of the plurality of joining regions and configured to form a flow channel in which a medium flows during use; and
a segmenting recessed portion arranged to extend at least longitudinally or transversely to an edge of the first substrate or the second substrate to segment the joining surface of the first substrate or the second substrate into the plurality of joining regions to be separate from one another,
wherein the segmenting recessed portion is not in fluid contact with the plurality of flow channel forming portions.